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850nm 3535 Package IR LED 2W ID

IR LED

850nm 3535 Package IR LED 2W ID

• PKG Size: 3.5x3.5mm

• Power: 2W


Product Advantages

High-power ceramics package, multi-angle optical design

35mil IR LED Chip

Size: 3.5mmx3.5mm

Solder method: SMT

    Specification

     Electro   Characteristics : (T solder pad =25℃)

    Part Number

    Lead Frame

    Peak Wavelength
     [nm]

    Total Rad Flux [mW]

    Type VF
    [V]

    Max VF
    [V]

    Directivity

    Max. Current
    [mA]

    LED Height

    2θ1/2

    IDP8530K

    3535

    850

    500~700

    1.6

    2.2

    30°

    700

    3.30mm

    IDP8550K

    3535

    850

    500~700

    1.6

    2.2

    50°

    700

    3.05mm

    IDP8584K

    3535

    850

    500~700

    1.6

    2.2

    60°

    700

    2.60mm

    IDP85120K

    3535

    850

    500~700

    1.6

    2.2

    80°

    700

    2.45mm

    IDP85130K

    3535

    850

    500~700

    1.6

    2.2

    90°

    700

    2.25mm

    IDP85120B

    3535

    850

    500~700

    1.6

    2.2

    120°

    700

    2.20mm

    IDP85140K

    3535

    850

    500~700

    1.6

    2.2

    160°

    700

    1.40mm

    Product Description

    Introducing our latest series of high-power IR chips with cutting-edge 3535 ceramic packaging technology. These chips are designed to provide exceptional heat conductivity, allowing for the operation of large currents without the risk of overheating. This makes them the ideal choice for applications in the Infrared security market, where reliability and performance are of utmost importance.

    One of the key features of our IR chips is their special optic design, which ensures a full range of emission angles to meet the diverse needs of the market. With options including 30°, 50°, 60°, 80°, 90°, 120°, and 160° angles, our chips can cater to a wide range of installation and coverage requirements. This versatility makes them a valuable asset for security systems of all sizes and configurations.

    Our team has worked tirelessly to develop these IR chips with the highest quality standards in mind. Each chip in this series is equipped with high-power 35mil IR chips, guaranteeing exceptional performance and reliability. The 3535 ceramic packaging technology further enhances the durability and longevity of the chips, ensuring they can withstand the demands of continuous operation in security applications.

    Whether you are looking to upgrade an existing security system or develop a new one, our high-power IR chips offer the performance and flexibility needed to meet the diverse requirements of the Infrared security market. With their advanced technology and comprehensive range of emission angles, these chips are the perfect choice for any project that demands reliable and effective IR illumination.

    In conclusion, our series of high-power IR chips with 3535 ceramic packaging technology is poised to set a new standard for performance and reliability in the Infrared security market. With their exceptional heat conductivity, special optic design, and full range of emission angles, these chips are ready to meet the diverse needs of security professionals and system integrators.

    Key Features

    High thermal conductive ceremic substrate  
    Large drive current  
    Unique optical design 
    Better heat dissipation and lower thermal resistance  

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